Composite wafer, semiconductor device and electronic component

ABSTRACT

An electronic component includes a semiconductor device including a semiconductor die including a first surface, the first surface including a first metallization structure and edge regions surrounding the first metallization structure, a second surface opposing the first surface and including a second metallization structure, and side faces extending between the first surface and the second surface, wherein the edge regions of the first surface and portions of the side faces are covered by a first polymer layer, wherein the electronic component further includes a plurality of leads and a plastic housing composition, wherein the first metallization structure is coupled to a first lead and the second metallization structure is coupled to a second lead of the plurality of leads.

RELATED APPLICATIONS

The instant application is a continuation of and claims priority to U.S.Ser. No. 16/874,146 filed on May 14, 2020, which in turn is a divisionalof Ser. No. 16/081,236 filed on Aug. 30, 2018, which in turn claimspriority to PCT Application EP 2017/054530 filed on Feb. 27, 2017.

BACKGROUND

In order to manufacture a single semiconductor device, such as atransistor, a photonic or other device, a semiconductor wafer may beprocessed to form a plurality of semiconductor devices at componentpositions in the wafers. Depending on the structure of the semiconductordevices, a plurality of functional layers may be formed on the wafer.The semiconductor wafer may include device regions which include theregion of semiconductor material in which the functional units of thedevice are arranged and a non-device region, also known as a saw streetor kerf. The non-device regions may surround each device region anddelineate the component positions. Typically, the device regions areformed in a regular array of rows and columns so that the non-deviceregions have the form of an orthogonal grid. After forming the relevantcomponents of the device, the wafer is separated into single chips ordies, for example by dicing the wafer, for example by sawing. The chipsor dies may be separated from the wafer by cutting through the thicknessof the wafer along the non-device regions.

SUMMARY

In an embodiment, a composite semiconductor substrate includes a firstpolymer layer and one or more semiconductor dies having a first surface,a second surface opposing the first surface, side faces extendingbetween the first surface and the second surface and a firstmetallization structure on the first surface. Edge regions of the firstsurface and at least portions of the side faces are embedded in thefirst polymer layer and at least one metallic region of the firstmetallization structure is exposed from the first polymer layer.

In an embodiment, a method includes forming at least one trench innon-device regions of a first surface of a semiconductor wafer, thenon-device regions being arranged between component positions, thecomponent positions including device regions and a first metallizationstructure, applying a first polymer layer to the first surface of asemiconductor wafer such that the trenches and edge regions of thecomponent positions are covered with the first polymer layer and suchthat at least a portion of the first metallization structure isuncovered by the first polymer layer, removing portions of a secondsurface of the semiconductor wafer, the second surface opposing thefirst surface, revealing portions of the first polymer layer in thenon-device regions and producing a worked second surface and inserting aseparation line through the first polymer layer in the non-deviceregions to form a plurality of separate semiconductor dies.

In an embodiment, a semiconductor device includes a semiconductor diehaving a first surface, the first surface including a firstmetallization structure and edge regions surrounding the firstmetallization structure, a second surface opposing the first surface andincluding a second metallization structure, and side faces. The edgeregions of the first surface and portions of the side faces are coveredby a first polymer layer and edge regions of the second surface andportions of the side faces are covered by a second polymer layer,wherein the second polymer layer is in contact with the first polymerlayer.

In an embodiment, an electronic component includes a semiconductordevice including a semiconductor die including a first surface, thefirst surface including a first metallization structure and edge regionssurrounding the first metallization structure, a second surface opposingthe first surface and including a second metallization structure, andside faces. The edge regions of the first surface and portions of theside faces are covered by a first polymer layer, edge regions of thesecond surface and portions of the side faces are covered by a secondpolymer layer, wherein the second polymer layer is in contact with thefirst polymer layer. The electronic component further includes aplurality of leads, wherein the first metallization structure is coupledto a first lead and the second metallization structure is coupled to asecond lead of the plurality of leads, and a plastic housingcomposition, wherein the plastic housing composition covers the firstpolymer layer and the second polymer layer.

Those skilled in the art will recognize additional features andadvantages upon reading the following detailed description and onviewing the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of embodiments of the invention and are incorporated inand constitute a part of this specification. The drawings illustrate theembodiments of the present invention and together with the descriptionserve to explain the principles. Other embodiments of the invention andmany of the intended advantages will be readily appreciated, as theybecome better understood by reference to the following detaileddescription. The elements of the drawings are not necessarily to scalerelative to each other. Like reference numbers designate correspondingsimilar parts.

FIGS. 1A to 1F illustrate a method of fabricating a semiconductor deviceaccording to an embodiment.

FIGS. 2A to 2F illustrate a method of fabricating a semiconductor deviceaccording to an embodiment.

FIGS. 3A to 3F illustrate a method of fabricating a semiconductor deviceaccording to an embodiment.

FIG. 4A illustrates a cross-sectional view of a semiconductor deviceaccording to an embodiment.

FIG. 4B illustrates a cross-sectional view of a semiconductor deviceaccording to an embodiment.

FIG. 5 illustrates a plan view of a semiconductor wafer.

FIG. 6A illustrates a cross-sectional view of a wafer according to anembodiment.

FIG. 6B illustrates a cross-sectional view of a wafer according to anembodiment.

FIG. 7 illustrates an arrangement for electrodepositing a conductivelayer onto a semiconductor wafer.

FIG. 8 illustrates a flowchart of a method of processing a semiconductorwafer according to an embodiment.

FIG. 9 illustrates apparatus for processing a semiconductor wafer.

FIG. 10A illustrates apparatus for processing a semiconductor wafer.

FIG. 10B illustrates apparatus for processing a semiconductor wafer.

FIGS. 11A to 11F illustrate a method for processing a semiconductorwafer.

FIG. 12A illustrates a cross-sectional view of a portion of asemiconductor wafer according to one or more embodiments.

FIG. 12B illustrates a cross-sectional view of a portion of asemiconductor wafer according to one or more embodiments.

FIG. 12C illustrates a cross-sectional view of a portion of asemiconductor wafer according to one or more embodiments.

FIG. 13A illustrates a cross-sectional view of a portion of asemiconductor substrate according to one or more embodiments.

FIG. 13B illustrates a plan view of a portion of a semiconductorsubstrate according to one or more embodiments.

FIG. 13C illustrates a perspective view of a semiconductor chipaccording to one or more embodiments.

FIG. 14 illustrates a method for processing a semiconductor waferaccording to one or more embodiments.

FIG. 15 illustrates a flow diagram of a method for manufacturing asemiconductor device.

FIGS. 16A to 16F illustrate methods for processing a semiconductorwafer.

FIGS. 17A to 17E illustrate methods for fabricating a semiconductordevice.

FIG. 18 illustrates a cross-sectional view of a semiconductor deviceaccording to an embodiment.

FIG. 19 illustrates a cross-sectional view of a composite waferaccording to an embodiment.

FIG. 20 illustrates a cross-sectional view of an electronic componentaccording to an embodiment.

FIG. 21 illustrates a cross-sectional view of an electronic componentaccording to an embodiment.

DETAILED DESCRIPTION

In the following detailed description reference is made to theaccompanying drawings, which form a part hereof and in which areillustrated by way of illustration specific embodiments in which theinvention may be practiced. In this regard, directional terminology suchas “top”, “bottom”, “front”, “back”, “leading”, “trailing” etc. is usedwith reference to the orientation of the Figures being described. Sincecomponents of embodiments of the invention can be positioned in a numberof different orientations, the directional terminology is used forpurposes of illustration and is in no way limiting. It is to beunderstood that other embodiments may be utilized and structural orlogical changes may be made without departing from the scope defined bythe claims.

The description of the embodiments is not limiting. In particular,elements of the embodiments described hereinafter may be combined withelements of different embodiments.

The terms “wafer”, “substrate” or “semiconductor substrate” used in thefollowing description may include any semiconductor-based structure thathas a semiconductor surface. Wafer and structure are to be understood toinclude silicon, silicon-on-insulator (SOI), silicon-on sapphire (SOS),doped and undoped semiconductors, epitaxial layers of silicon supportedby a base semiconductor foundation, and other semiconductor structures.The semiconductor need not be silicon-based. The semiconductor could aswell be silicon-germanium, germanium, or gallium arsenide. According toother embodiments, silicon carbide (SiC) or gallium nitride (GaN) mayform the semiconductor substrate material.

As used herein, the terms “having”, “containing”, “including”,“comprising” and the like are open ended terms that indicate thepresence of stated elements or features, but do not preclude additionalelements or features. The articles “a”, “an” and “the” are intended toinclude the plural as well as the singular, unless the context clearlyindicates otherwise.

The terms “lateral” and “horizontal” as used in this specificationintends to describe an orientation parallel to a first surface of asemiconductor substrate or semiconductor body, for example a majorsurface. This can be for instance the surface of a wafer or a die.

The term “vertical” as used in this specification intends to describe anorientation which is arranged perpendicular to the first surface, forexample the major surface, of the semiconductor substrate orsemiconductor body.

FIGS. 1A to 1F illustrate a method of manufacturing a semiconductordevice. FIG. 1A illustrates a semiconductor wafer or semiconductorsubstrate 100 having a first main surface 110 and a second main surface120 that opposes the first main surface 110. Components of semiconductordevices 250 have been processed in the first main surface 110 of thesemiconductor wafer. The semiconductor devices 250 may have been formedon or in the first main surface 110 of the semiconductor wafer 100. Forexample, processing and etching processes may have been performed so asto manufacture the structure of single devices 250 in the semiconductormaterial of the chip areas, or device areas 170 and further layers, e.g.insulating layers and/or passivation layers may be deposited onto thefirst main surface. A metallization structure may have been formed onthe first main surface 110 in the device areas 170. The chip areas 170are laterally spaced apart from the nearest neighbour by a certaindistance which corresponds to the non-device region or kerf 175. Thenon-device regions have a width and in plan view may form an orthogonalgrid of striped regions bounding a square or rectangular device region.

Separation trenches 210 are formed in the first main surface 110, inparticular in the non-device regions 175. For example, the separationtrenches 210 may be formed by sawing, e.g. using a diamond saw, or bylaser sawing. However, the separation trenches 210 may be also formed byany other suitable method, e.g. etching.

The separation trenches may be formed so that a bottom side or base 210a of the separation trenches 210 is disposed in and formed by thesemiconductor substrate 100. The separation trenches 210 extend to apredetermined depth in the semiconductor substrate 100 and do not extendthroughout the entire thickness of the semiconductor substrate 100 fromthe first main surface 110 to the second main surface 120. The depth ofthe separation trenches 210 may be selected so as to be larger than thetarget thickness of the semiconductor devices that are to be formed fromthe semiconductor substrate 100 after performing a later thinningprocess. The separation trenches may have a width of around 10 μm to 60μm and a depth of around 30 μm to 70 μm. The device regions 170 arepartially separated from the wafer 110 and form protruding regionsbounded by a grid of orthogonal trenches 210.

In some embodiments, a sacrificial material 220 is inserted into theseparation trenches 210 and may fill the separation trenches 210. Forexample, the sacrificial material 220 may be a glue or adhesive. Thesacrificial material 220 may be deposited by a spin-coating or printingprocess and may form a continuous layer throughout the lateral extent ofthe first main surface 110 including the planar surface of the deviceregions 170 and may fill the trenches 210. In embodiments, in which thesacrificial material is an adhesive, the semiconductor wafer 100 may beattached to a suitable carrier 300, e.g. a glass carrier by means of thecontinuous layer of sacrificial material 220. The first main surface 110is disposed on and covered by the carrier 300, as is illustrated in FIG.1B and the sacrificial material 220 is in continuous contact with thecarrier 300.

Thereafter, a thinning process may be performed so as to removesubstrate material from the second main surface 120 of the semiconductorsubstrate 100 and reduce the thickness of the semiconductor substrate100. For example, substrate material may be removed from the second mainsurface 120 using a mechanical method, such as grinding, or a chemicalmethod, such as etching or a combination of these methods. In someembodiments, the semiconductor substrate 100 may be thinned bymechanical grinding, followed by a CMP (Chemical Mechanical Polishing)process so as to remove defects which may be caused by the grinding, orby mechanical grinding followed by wet etching or plasma etching. Insome embodiments, the starting thickness of the semiconductor substratemay be around 750 μm to 800 μm. The thinning process may be performed tothin the semiconductor substrate 100 to a predetermined thickness whichmay be less than 100 μm, e.g. 10 μm to 50 μm.

The thinning process may be carried out until sufficient material isremoved that the sacrificial material 220 positioned in the trenches 210is uncovered and forms part of the worked second main surface of thethinned semiconductor substrate. The bottom side 210 a of the separationtrenches 210 formed by the semiconductor material is removed. As isillustrated in FIG. 1C, each of the single chips 260 is embedded in amatrix of the sacrificial material 220. The sacrificial material 220 isdisposed between adjacent chips 260 and extends from the first mainsurface 110 to the worked second main surface 120 and forms a continuouslayer between the semiconductor device 250 and the carrier 300. Thesingle chips 260 are mechanically separated but bound by the sacrificialmaterial. The assembly of single chips 260 and matrix provided by thesacrificial material 220 may be considered to be a composite wafer.

In some embodiments, the sacrificial material 220 is removed byprocessing from the second main surface 120 of the semiconductorsubstrate 100. In some embodiments, recesses 265 may be formed in thesacrificial material 220 that is disposed between adjacent chips 260.For example, the recesses 265 may be formed by plasma etching in an O₂plasma. FIG. 1D shows an example of a resulting structure in which thesacrificial material 220 has been partially removed from the side facesof the single chips 260 in regions adjacent the worked second mainsurface 120. Portions of the side faces of the single chips 260 adjacentthe first main surface remain coupled by the remainder of thesacrificial material 220.

In some embodiments, such as that illustrated in FIG. 1E, ametallization layer 400 may be formed over the resulting surface so thatthe metallization layer 140 covers the second side of the semiconductorchips 260, uncovered side faces of the semiconductor chips 260 and theremaining sacrificial material 220 arranged between the semiconductorchips 260. For example, the metallization layer may be deposited using asputtering method or a metal evaporation method. For example, themetallization layer may include a metal such as Al, Ti, Ag, Cu, or Ni.The metallization layer may have a thickness of approximately 100 nm-10μm. The assembly including the chips 260 fixed together by thesacrificial material 220 may be referred to as a composite wafer.

The single chips 260 may be separated or singulated from the compositewafer to form separate devices. In some embodiments, a carrier 510 isapplied to the assembly of chips 260 fixed together by the sacrificialmaterial 220, in particular to the second main surface. The separatingcarrier 510 may be a foil, e.g. a sawing foil which may be carried by asuitable frame 500. The assembly of chips 260 may be mounted on theseparating carrier 510 so that the metallization layer 400 is adjacentto and in contact with the separating carrier 510 and the carrier 300 isremoved to expose the sacrificial material 220 on the first main surface110. The sacrificial material 220 may be removed to separate the singlechips 260. As is shown in FIG. 1F, the sacrificial material may beremoved by processing or working the first main surface 110 of thesemiconductor substrate 100.

When removing the sacrificial material 220, the sacrificial material 220present in the separation trenches 210 between adjacent chips 260including a portion of the metallization layer formed on the sacrificialmaterial that extends between neighbouring chips 260 in the recess 265is removed. As a result, the single chips 260 are separated from theassembly or composite wafer, as is illustrated in FIG. 1F, and may bearranged spaced apart from one another on the carrier 510.

In some embodiments, such as that illustrated in FIG. 1F, the singlechips 260 include a metallization structure that extends from the rearsurface onto a least portions of the side faces. This arrangement may beused to control bleed out during soldering of the rear surface onto asubstrate, for example a die pad. The portion of the metallizationstructure on the side faces may encourage the formation of a meniscus ofmolten solder and limit the lateral extent of the flow of solder. Thismay assist in improving the reliability of the solder joint and/or theyield of reliable solder joints.

FIGS. 2A to 2F illustrate cross-sectional views of a semiconductorsubstrate 100 during a method according to a further embodiment. Thesemiconductor substrate 100 illustrated in FIG. 2A is similar to thesemiconductor substrate 100 shown in FIG. 1A. Further, the steps shownin FIGS. 2B and 2C are similar to the steps described with reference toFIGS. 1B and 1C, respectively. For example, the thickness of thesemiconductor substrate 100 after removing the substrate material may be10 μm to 40 μm. In contrast to the embodiment illustrated in FIGS. 1A to1F, in some embodiments, such as that illustrated in FIG. 2D, thesacrificial material 220 is not recessed or partially removed from thesecond side after the thinning process is performed. In this embodiment,the second main surface 120 is planar and includes areas of thesemiconductor chips 260 bounded by the sacrificial material 220.

In some embodiments, a metallization layer is formed on the second mainsurface 120 of the semiconductor wafer and therefore on the secondsurface of the semiconductor chips and sacrificial material 220 to forma planar continuous layer. The metallization layer may include a metalseed layer 410 and a thick metallization layer 420 formed on the seedlayer 410. For example, the seed layer may include titanium or atitanium compound layer having a thickness of approximately 50 nm to 200nm. The seed layer may further include a thin copper layer, e.g. havinga thickness of 50 nm to 400 nm formed over the titanium or titaniumcompound layer. By way of example, the seed layer(s) may be formed bysputtering. The thick metallization layer 420 may include or be a copperor a copper compound layer. For example, the copper layer may be formedby a galvanic method. The copper layer may have a thickness ofapproximately 10 μm to 30 μm. FIG. 2D shows an example of a resultingstructure.

A photolithographic method may then be performed so as to form grooves430 in the thick metallization layer 420. The grooves 430 may bearranged above the sacrificial material 220 and therefore in thenon-device regions or saw streets. FIG. 2E shows an example of aresulting structure. According to an embodiment, the seed layer may beetched by this processing step to form separate conductive areas on thedevice regions that are separated and spaced apart by the sacrificialmaterial 220. According to a further embodiment, a portion of the seedlayer, e.g. the titanium or titanium compound layer may remain in thenon-device regions.

The assembly of chips 260 embedded in the sacrificial material 220 andincluding the metallization layer 420 and optionally the seed layer ismounted to a suitable separating carrier 510. The separating carrier 510may have the form of a foil as in the embodiment described in connectionwith FIG. 1F. The carrier 300 is removed from the first main surface 110and the sacrificial material 220 is removed so as to separate the singlechips 260 from another, whilst the chips 260 remain attached to thecarrier 510. The sacrificial layer 220 may be removed from the firstmain surface 110 of the semiconductor substrate 100. The sacrificiallayer 220 may be removed entirely from the side faces. In embodimentsincluding a seed layer, the portion of the seed layer arranged on thesacrificial layer 220 that extends between neighbouring chips 160 may beremoved or diced by this process. The thick metallization layer 420 maybe a so-called power metallization layer which may be used so as toconduct large currents.

FIGS. 3A to 3F illustrate a method according to an embodiment. Asemiconductor substrate 100 may be processed as described above withreference to FIG. 1A to introduce trenches 210 into first main surfaceof the semiconductor substrate 100, in particularly, into the non-deviceareas so as to partially separate the chips 260 from the wafer 100. Inthis embodiment, an insulating material 270 is inserted into theseparation trenches 210. The insulating material 270 may be aninsulating polymer, such as an epoxy resin, or a ceramic material, suchas a ceramic material including a silicon oxide or a silicon nitride.The insulating layer 270 may be inserted in the separation trenches 210using a printing process. Then, an adhesive layer 280 is formed over thefirst main surface 110 of the semiconductor substrate 100 which coversboth the insulating material 270 and first main surface of the partiallyseparated chips 260 continuously. A carrier 300, e.g. a glass carrier,is mounted on the adhesive layer 280. As a result, as is illustrated inFIG. 3B, the semiconductor wafer 100 is mounted on the carrier 300 sothat the first main surface 110 is disposed on a side adjacent to thecarrier 300 and is covered by the carrier 300.

In a similar manner as has been described above with reference to FIGS.1C and 2C, the semiconductor substrate 100 is thinned from the opposingside of the wafer, i.e. material is removed from the second main surface120. The thinning process is performed until the target thickness of thesemiconductor substrate 100 is reached and/or the insulating material270 arranged in the trenches 210 is uncovered so that the chips 260 areno longer mechanically attached to one another by semiconductormaterial. In particular, a mechanical force is no longer transferredfrom one chip to the next by means of the semiconductor material.Consequently, a crack is prevented from propagating from one chip toanother. In the event that a crack is formed in a chip 260 during theseparation of the chips, it cannot propagate to further chips through acommon semiconductor material so that damage to further chips can beavoided and the yield increased. The insulating material 270 is disposedbetween adjacent chips 260, and an adhesive layer 280 is disposedbetween the chips and the carrier 300. The single chips 260 are coupledby the insulating material 270 to form a composite wafer.

A metallization layer 410, 420 may be formed over the second mainsurface 120 which covers the second surface of the semiconductor chips260 and the insulating material 270. This may be performed in the manneras has been described above with reference to FIG. 1E or 2D. When themetallization layer is formed in the manner as has been described abovewith reference to FIG. 2D, a photolithographic process including anetching process may be performed so as to separate the metallizationlayer into portions arranged on the device areas of the single chips260. The seed layer 410 may be etched and removed in the non-deviceregions or maintained. FIG. 3D shows an example of a resultingstructure.

The assembly of chips 260, in particular the metallization layer 410,420, is mounted on a separating carrier 510 to separate the singledevices from the composite wafer, as described above. The singlesemiconductor chips 260 are separated from each other and from theassembly or composite wafer, for example using a laser sawing or dicingprocess, by removing at least a portion of the insulating material 270to form a gap from the first surface to the second surface. If lasersawing is used, a laser beam may be directed at the first main surfaceat the insulating material 270 arranged between adjacent chips 260. If aportion of the seed layer 410 still is present between adjacent chips260, this portion may be diced or cut by the singulation or separatingprocess. As is illustrated in FIG. 3F, adjacent chips may be separatedat a boundary line 435 so that a portion of the insulating material 270remains on a side wall of each of the chips 260.

In the embodiment described with reference to FIGS. 3A to 3F, thesacrificial material 270 may be implemented by an insulating material sothat the side walls of the semiconductor chip 260 are provided withinsulation by the portion of the insulating material 270 remaining onthe side wall or side faces of the chip 260.

FIGS. 4A and 4B show cross-sectional views of semiconductor chips 260.In FIG. 4A, functional devices or components of a semiconductor device250, for example a transistor such as a MOSFET, are formed in thesemiconductor chip 260 and a metallization structure including contactpads may be formed on the first main surface in the device regions. Abackside metallization layer 400 is formed on a second main surface 120of the semiconductor chip 260. An insulating layer 270 is formed on aside wall 115 of the semiconductor chip 260. For example, the insulatingmaterial 270 may be an insulating polymer, e.g. an insulating carboncompound. Specific examples include an epoxy resin, a plastic material,or a ceramic material, e.g. including silicon oxide or silicon nitride.The insulating material may have a thickness of approximately 5 μm to 20μm. The insulating material is integrally formed to cover the side wallof the semiconductor chip 260. The semiconductor chip 260 may have athickness d of 5 μm to 100 μm, e.g. 5 μm to 20 μm.

FIG. 4B shows a cross-sectional view of a semiconductor chip 260according to an embodiment. The insulating layer 270 may be cut with alaser and a cut surface 275 of the insulating layer 270 may be rough, inparticular may have a greater surface roughness that the upper uncutsurface of the insulating layer 270. A portion of the insulating layer270 may be burned so as to form a rough surface 275 due to the laserdicing process.

FIG. 5 shows a schematic view of a wafer 100 including a notch 103 foraligning the wafer in a wafer processing or wafer handling system in apre-determined orientation. FIG. 5 further shows a plurality ofseparation trenches 210. As is shown, the separation trenches includefirst separation trenches 211 which extend in a first direction, andsecond separation trenches 212 which extend in a second directionperpendicular to the first direction.

According to the embodiments described above with reference to FIGS. 1Ato 3F, the semiconductor wafer 100 is thinned substantially uniformlyover the second main surface 120 to form a substantially planar surface.According to a further embodiment, this thinning process may be carriedout so that more substrate material is removed from a central portion116 of the semiconductor wafer than from an edge portion 117 of thesemiconductor wafer, i.e. a recess in a central portion of the secondmain surface may be formed. A ring protruding from the second mainsurface may be formed at the periphery of the recess which may be usedto provide stability for the semiconductor wafer during subsequentprocessing and handling. The ring may be continuous.

The removing substrate material from the second main surface 120 of thesemiconductor substrate 100 may include a a first process of removingsubstrate material from the entire second main surface, and a secondprocess of removing substrate material from a central portion of thesemiconductor substrate to form a recess while maintaining an edgeportion of the semiconductor substrate.

The first thinning process may be performed so as to reduce thethickness of the wafer to 50 to 100 μm. The first thinning process mayinclude etching and may remove substrate material from the centralportion of the semiconductor substrate and from the edge portion toproduce a substantially planar worked surface. A second thinning may beperformed which only thins the central portion 116 of the semiconductorwafer 100, whereas the edge portion 117 is not thinned during the secondthinning process.

FIG. 6A shows an example of a semiconductor wafer 100 including acentral portion 116 and an edge portion 117. As a result of performingthe first and the second thinning process as explained above, athickness d1 of the edge portion 117 is larger than a thickness d2 ofthe central portion 116. For example, a thickness d1 of the edge portion117 may be 30 μm to 150 μm after performing the thinning process. Athickness d2 of the central portion 116 may be 5 μm to 100 μm afterperforming the second thinning process. A ratio of thicknesses d1 to d2may be approximately 2 to 5. A width s of the edge portion 117 may be0.5 to 5 mm.

Before performing the thinning process(es), a plurality of separationtrenches 210 are formed in the first main surface 110 of thesemiconductor wafer opposing the second main surface of thesemiconductor substrate 100 in both the central region 116 and in theprotruding edge portion 117 and sacrificial material or insulatingmaterial Is inserted into the trenches 210. Each of the trenches 210 hassubstantially the same depth so that, after the second main surface hasbeen worked to remove material and to form the recessed central region116, the sacrificial material 220 is uncovered and extends throughoutthe remaining thickness of the central portion 116. In the edge regions117, however, the trenches 220 have a base that is formed by thematerial of the semiconductor wafer since the depth d1 is greater thanthe depth of the trenches 210. A curved interface is formed between therecessed central portion 116 and the edge portion 117 due to the shapeof the grinding tool and grinding motion used to form the centralportion 116. This interface may provide a pre-determined breaking point,as its indicated by the arrow in FIGS. 6 a and 6 b , which may assist inthe removal of the edge portion 117. The edge portion 117 may notinclude device regions.

After performing the first and the second thinning process as has beendescribed above, the wafer may be further processed in the manner as hasbeen described above with reference to FIGS. 1D to 1F, 2D to 2F or 3D to3F to form a metallization on the second main surface and to partiallyor entirely remove the sacrificial material 220 to separate thesemiconductor chips or dies from the semiconductor substrate 100.

Due to the presence of the thicker edge portion 117, the chips 260 atthe edge region of the wafer may be prevented from flying away whensubjected to mechanical force during separation or singulation. When thewafer is mounted on the separating carrier 510 as is shown in FIGS. 1F,2F and 3E, for example, the single chips may be separated from eachother by removing the foil, for example by peeling or tearing off thefoil. The separation trenches 210 are formed in the edge portion 117 andextend in the first and the second direction and are positioned at theboundary of each chip or component position. Upon removal of the foil510, the edge portion 117 is separated from the remainder and the chipsmay be separated from each other.

FIG. 6B illustrates a cross-sectional view of a portion of thesemiconductor substrate 100 according to an embodiment. In addition tothe components shown in FIG. 6A, a metallization layer 400 is formed onthe second main surface 120 of the semiconductor substrate 100. In someembodiments, the metallization layer 400 is formed in the centralportion 116 of the semiconductor substrate 100 and is absent from theedge portion 117.

In some embodiments, the metallization layer 400 may be selectivelyformed in the central portion 116, for example, by using a shadow mask.The metallization layer 400 may be formed by a deposition method such asa chemical vapour deposition method, by a thermal vapour depositionmethod or by a sputtering method. In some embodiments, the metallizationlayer 400 may be formed by depositing a continuous layer over thecentral portion 116 and edge portion 117 and by removing, for example byetching, the metallization layer 400 from the edge portion 117.

In some embodiments, the metallization layer 400 may be selectivelydeposited into the central portion of the second main surface 120 of thesemiconductor substrate 100 using a galvanic process, as will bedescribed below with reference to FIG. 7 .

FIG. 7 illustrates a cross-sectional view of a semiconductor wafer 100and a chuck 720 that supports a carrier 300 in contact with andsupporting the first main surface of the the semiconductor substrate100. A metallization layer such as copper may be deposited using agalvanic process onto the second main surface. The metallization layer400 may include a seed layer 410 and a thick metallization layer 420which is built up on the seed layer 410. The seed layer 410 may bedeposited using a physical vapour deposition process such as sputteringonto the entire second main surface such that it forms a continuouslayer over the edge portion 117, central portion 116 and interfacebetween the recessed central portion 116 and the protruding edge portion117.

FIG. 7 shows a member 700 having an arm 730 with protrusions 731 whichare in contact with the seed layer 410 arranged on the edge portion 117and a larger head 732 which extends into the recess and is in contactwith the seed layer 410 in a peripheral region of the central portion116 adjacent the interface. The member 700 may act to seal a portion ofthe central portion 116 so that the thick metallization layer 420 isselectively formed in the central portion 116. The member 700 ismetallic and together with the seed layer 410 my act as an electrode inthe electrodeposition of the thicker metallization layer 420 in thecentral portion 116 in regions uncovered by, and central to, the head732.

The thick metallization layer 420 has a thickness d3 and reduces aheight difference between the outer surface of the edge portion 117 andthe outer surface of the metallization layer 420. A reduced heightdifference may assist in simplifying handling of the semiconductorwafer. In particular, wafer bowing may be avoided, for example when thesemiconductor wafer is mounted to the separating foil 510. In theexample shown in FIG. 7 , a thickness d1 of the semiconductor substratein the edge portion 117 may be approximately 50 μm, a thickness d2 ofthe semiconductor substrate 100 in the central portion 116 may beapproximately 20 μm. A thickness of the thick metallization layer 420may be 10 to 15 μm. A width s of the edge portion 117 may be 1.5 mm.

FIG. 8 illustrates a flow diagram of a method of manufacturing asemiconductor device according to embodiment. The method includesforming a plurality of separation trenches in a first main surface of asemiconductor substrate, a bottom side of the separation trenches beingdisposed in the semiconductor substrate such that the base of the trenchis formed by material of the semiconductor substrate (S100). The methodfurther includes inserting a sacrificial material in the separationtrenches (S110), removing substrate material from a second main surfaceof the semiconductor wafer to uncover a bottom side of the separationtrenches and sacrificial material (S120), mounting the semiconductorsubstrate onto a separating carrier so that a second main surface of thesemiconductor substrate is disposed on a side of the separating carrier(S130), and thereafter, separating the semiconductor substrate into aplurality of semiconductor chips (S140).

In an embodiment, the removing substrate material from the second mainsurface of the semiconductor substrate (S120) may include a firstprocess of removing substrate material from the entire second mainsurface (S125), and a second process (S127) of removing substratematerial from a central portion of the semiconductor substrate to from arecess while maintaining an edge portion of the semiconductor substratewhich bounds the recess.

FIG. 9 schematically illustrates apparatus 600 for processing asemiconductor wafer 100. The apparatus 600 includes a unit 610configured to a form a plurality of separation trenches in the firstmain surface of the semiconductor substrate, a bottom side of theseparation trenches being disposed in the semiconductor substrate. Forexample, the unit 610 may include a saw, e.g. a diamond or similar saw,a laser saw or a etching device which may etch separation trenches at ahigh precision so that a predetermined depth of the separation trenchesis achieved.

The apparatus 600 may further includes a unit 620 configured to insert asacrificial material in the separation trenches. For example, this unit620 may be any kind of a printing or spin coating device. Optionally,the apparatus 600 may further include a unit 625 that is configured tomount the semiconductor wafer on a carrier, e.g. a glass carrier so thatthe first main surface is disposed on a side adjacent to the carrier.The apparatus may include a unit 630 configured to remove substratematerial from a second main surface of the semiconductor substrate so asto uncover the bottom side of the separation trenches. For example, thisunit 630 may include a grinding device, a polishing unit, an etchingunit, a CMP unit and others. The apparatus 600 may further include aunit 640 configured to mount the assembly of the semiconductor chipsfixed together by the sacrificial material on a separating carrier sothat the second main surface is disposed on a side adjacent to thecarrier. The unit 640 may transfer the assembly of semiconductor chipswhilst the separating trenches are filled with the sacrificial material.The unit 640 may be a handling unit which laminates the assembly ofchips on the carrier.

The apparatus 600 may be a cluster tool in which the several units maybe housed. For example, the wafer may be transferred between thedifferent units without being exposed to ambient air. The apparatus 600may also be provided in the form of a production line with each unitbeing provided by separate apparatus.

The apparatus 600 may further include a unit 650 configured to form ametal layer over the second main surface after removing the substratematerial from the second main surface. The 650 may be a galvanic unit ora chemical vapor deposition device, a physical vapour deposition device,a sputtering device or any other suitable device for forming a metallayer.

The unit 630 that is configured to remove a substrate material from asecond main surface of the semiconductor wafer to uncover the bottomside of the separation trenches may be configured to perform a firstremoving step for removing substrate material from the entire secondmain surface and to perform a second process for removing substratematerial only from a central portion of the semiconductor wafer.

FIG. 10A illustrates the unit 630 which, in this embodiment, may agrinding device. The unit 630 may include a chuck 720 that may be fixedto a first shaft 830 that may rotate the chuck 720 in a first rotationaldirection, e.g. clockwise. A carrier 300 supporting the semiconductorsubstrate 100 may be mounted to the chuck 720. The second main surface120 of the semiconductor substrate 100 is uncovered. The unit 630further includes an element 850 carrying a second shaft 840 that mayrotate a first grinding wheel 810 in a second rotational direction, e.g.counter-clockwise. The first grinding wheel 810 may have a diameter thatapproximately corresponds to a diameter of the semiconductor substrate.The grinding wheel 810 includes a grinding portion 820 that is arrangedat an edge portion of the grinding wheel along the circumference of thegrinding wheel 810. The grinding portion 820 includes abrasive grainssuch as made of diamond that grind and mechanically remove the substratematerial from the second main surface 120. When performing a grindingprocess, the chuck 720 supporting the carrier 300 and the semiconductorsubstrate 100 is rotated in a first rotational direction, and the firstgrinding wheel 810 is rotated in a second rotational direction. At thesame time, the element 850 is moved so that the first grinding wheel 810is brought into contact with the semiconductor substrate 100. Further,the first rotating grinding wheel is moved along the circumference ofthe semiconductor substrate 100. Thereby, the first process of removingsubstrate material from the entire second main surface of thesemiconductor substrate may be performed.

For performing the second process of removing substrate material from acentral portion of the semiconductor substrate while maintaining theedge portion of the semiconductor substrate, a smaller second grindingwheel 815 replaces the first grinding wheel 810 as is illustrated inFIG. 10 b.

The second grinding wheel 815 is similar to the first grinding wheel 810but has a smaller diameter. For example, a diameter of the secondgrinding wheel 815 may be approximately half of the diameter of thefirst grinding wheel. The chuck 720 is rotated in a first rotationaldirection, and the semiconductor substrate 100 is rotated in a secondrotational direction opposing the first rotational direction. Theelement 850 is moved so that the second grinding wheel 815 is broughtinto contact with the semiconductor substrate 100. The second grindingwheel 815 is positioned to a central portion 116 of the semiconductorsubstrate 100. Further, the second rotating grinding wheel 815 is movedalong the central portion 116 of the semiconductor substrate 100 toproduce a recessed central portion bounded by a circular ring-shapededge portion having a greater thickness.

Due to the processing method described herein including formingseparation trenches in a semiconductor substrate, filling a sacrificialmaterial or insulating material into the separation trenches, thinningthe semiconductor substrate and, thereafter, separating the singlesemiconductor chips, the semiconductor chips are fixed and protected bythe sacrificial material after having been mechanically separated fromthe thinned semiconductor substrate. After thinning the semiconductorsubstrate, the semiconductor chips are mechanically separated but stillbound by the adjacent sacrificial or insulating material in an assemblyor composite wafer. As a result, damage due to the close spatialrelationship of adjacent semiconductor chips may be prevented, and thesemiconductor chips can be handled in an easy manner.

Due to the process of removing the substrate material including a firstprocess and a second process, a stabilizing edge portion of thesemiconductor substrate may be maintained so that single chips may beprevented from flying away when the supporting foil is removed from thesecond main surface. The thicker edge portion of the semiconductorsubstrate may be destroyed when separating the single chips or thethicker edge-portion may crack when the foil is expanded for the chipremoval or pick-up-process. Due to the concept of forming separationtrenches and filling the separation trenches with a sacrificialmaterial, cracks and stress generated during this destruction of theedge portion will not affect the single chips.

FIGS. 11A to 11F show cross-sectional views of a portion of asemiconductor substrate when performing a method according to one ormore further embodiments. According to one or more embodiments, afterthe thinning process in which material s removed from the second mainsurface 120, protruding portions of an insulating material may be formedover the second main surface 120 of the semiconductor substrate 100 soas to be positioned over the separation trenches 210.

Starting point for performing the method according to one or moreembodiment may be e.g. the structure shown in FIG. 2C or 3C. Forexample, a semiconductor substrate 100, such as a wafer may have beenprocessed so that components of the semiconductor devices 250 are formedadjacent to a first main surface 110 of the semiconductor wafer andseparation trenches 210 are formed in the semiconductor substrate 100 inthe non-device regions adjacent the semiconductor devices 250. Theseparation trenches 210 separate adjacent device areas from each other.A sacrificial material 270 may be insulating is arranged in and may fillthe separation trenches 210. The sacrificial material 270 may cover theentire surface of the first surface of the semiconductor wafer 100. Thefirst main surface 110 may be attached to the carrier 300 by means of anadditional adhesive layer 280. The adhesive layer 280 may be arrangedbetween the first main surface 110 and the carrier 300. To ametallization layer on the second main surface 120 of the semiconductorsubstrate, a seed layer 410 may be deposited. For example, the seedlayer may include a layer stack including one or more titanium layersand/or one or more copper layers. FIG. 11A shows an example of aresulting structure. Thereafter, protruding portions 810 of aninsulating material may be formed over the second main surface 120. Theprotruding portions 810 may be arranged at positions of the separationtrenches 210 and surround the device regions of the semiconductor chips.

FIG. 11B shows an example of a resulting structure. As is shown, theprotruding portions 810 of the insulating material are arranged atpositions of the separation trenches 210. According to some embodiments,the material of the protruding portions 810 may be the same as thesacrificial material 270. For example, the material of the protrudingportions 810 may be an epoxy resin. For example, the epoxy resin may bean epoxy resin that may be patterned using UV light. For example, afterperforming a patterning process, e.g. using UV light, a thermaltreatment may be performed. For example, the protruding portions mayhave a height of approximately 7 to 10 μm.

Thereafter, a metallization layer 420 may be formed over the second mainsurface 120 to cover the spaces between adjacent protruding portions810. FIG. 11C shows an example of a resulting structure. According toembodiments, the metallization layer 420 may be formed so that theprotruding portions 810 protrude over the metallization layer 820. Forexample, a height h2 of the protruding portions 810 may be larger than aheight h1 of the metallization layer 420, e.g. the difference may be 2to 3 μm. FIG. 11D shows an example of corresponding embodiments.

According to further embodiments, the metallization layer 420 may beflush or substantially coplanar with the protruding portions 810. Forexample, the height h2 of the protruding portions 810 may beapproximately equal to the height h1 of the metallization layer 420.FIG. 11E shows an example of a corresponding structure.

According to further embodiments, the height h1 of the metallizationlayer may be larger than the height h2 of the protruding portions 810.FIG. 11F shows an example of a corresponding structure. The height h2 ofthe protruding portions 810 in comparison to the height h1 of themetallization layer 420 may be selected in accordance with the desiredfunctionality of the protruding portions 810. Generally, due to thepresence of the protruding portions 810, the stability of the singlesemiconductor chips 260 may be improved. For example, the semiconductorchips 260 may be mechanically supported at the edge of the first orsecond main surface. Moreover, the semiconductor chips 260 may bemechanically supported at the edge of the first or second main surface.Moreover, the semiconductor chips 260 may be mechanically stabilized, inparticular, during the processing steps of forming the metallizationlayer and isolating the single chips. This may be useful, in particular,when the substrate has been thinned to a small thickness of e.g. lessthan 100 μm, more specifically less than 50 μm. In addition, thesidewalls of the semiconductor chips may be protected. For example, inthe arrangement illustrated in FIG. 11D, the protruding portions 810 mayprovide a solder stop so that when soldering the semiconductor chips,soldering material may be prevented from flowing away.

According to the embodiment shown in FIG. 11E, the back side of thesemiconductor chips 260 may be planar. According to the embodimentsshown in FIG. 11F, the electrical connection between soldering and theback side metallization may be improved. According to the embodimentsdescribed with reference to FIGS. 11A to 11F, the metallization layer isformed after forming the protruding portions.

According to further embodiments, the protruding portions 810 may beformed after forming the metallization layer. For example, starting fromthe workpiece shown in FIG. 11A, a further metallization layer 420 maybe formed over the second main surface 120 of the semiconductorsubstrate 100. Thereafter, the metallization layer 420 and the seedlayer 410 may be patterned so that metallization pads 425 are disposedover the semiconductor chips 260. FIG. 12A shows an example of aresulting structure. As is shown, adjacent semiconductor chips 260 areseparated from each other by means of the separation trenches 210 filledwith a sacrificial material 270. The single metallization pads 425 arespaced apart and isolated from each other by intervening regions of thesacrificial material 270.

Thereafter, the protruding portions of insulating material may be formede.g. by a printing method which selectively prints the material of theprotruding portions 810 in the recesses between adjacent metallizationpads 425. According to embodiment, the protruding portions may be formedby screen printing an epoxy resin over the second main surface 120.According to further embodiments, a layer of the material may be formed,followed by a patterning process, e.g. by photolithographicallypatterning the material layer. As a result, the spaces between adjacentmetallization pads 425 are filled by the protruding portions 810.According to some embodiments, as is shown in FIG. 12B, the protrudingportions 810 may be formed so as to protrude above the metallization pad425 and may cover edge regions of the metallization pad 425. Accordingto a further example, as is shown in FIG. 12C, the metallization pad 425may protrude above the protruding portion 810. In another embodiment,the protruding portion 810 may be flush with a metallization pad 425 sothat an upper surface of the metallization pad 425 and of the protrudingportion 810 may be approximately at the same level. Due to the presenceof the protruding portions 810 on the second main surface, thesemiconductor chip assembly or composite wafer may be mechanicallystabilized during processing.

FIG. 13A illustrates a cross-sectional view of adjacent semiconductorchips 260 after performing a separation process. The separation processmay be performed by a laser dicing process or a mechanical dicingprocess. The metallization layer of the semiconductor chips 260 isarranged on a separating carrier 510, the glass carrier is removed andthe semiconductor chips 260 diced from the composite wafer by insertinga separation line into the sacrificial material 270 and protrudingportion 810. The separation line has a width that is less than the widthof the sacrificial material 270 so that sacrificial material may remainon at least portions of the side wall of the semiconductor chips 260.Due to the presence of the sacrificial material 270 on the sidewalls ofthe semiconductor chips 260, the semiconductor chips 260 are laterallyinsulated. Due to the presence of the protruding portions 810, thesidewalls of the metallization pad 425 of the patterned metallizationlayer 420 are protected. For example, a height of the protruding portion810 may be approximately 8 to 10 μm. The protruding portion 810 mayoverlap with the metallization layer 420, 425 in a vertical direction sothat the width of the protruding portion decreases and the width o themetallization pad 425 increases in a vertical direction away from thesecond surface. A thickness of the semiconductor chip 260 may be lessthan 100 μm, e.g. less than 50 μm or less than 20 μm. The thickness ofthe semiconductor chip 260 may be more than 1 μm or more than 5 μm.

FIG. 13B illustrates a plan view of a second main surface 120 of aportion of a semiconductor substrate. As is shown, the protrudingportions 810 are formed so as to enclose the central portion of asemiconductor chip 260. The protruding portion 810 may completelysurround a semiconductor chip. The metallization layer 420, 425 isdisposed in the central portion of each of the semiconductor chips 260.

FIG. 13C illustrates a perspective view of a semiconductor chip 260according to one or more embodiments. The semiconductor chip 260includes an insulating material 270 disposed on a side wall of thesemiconductor chip 260, the insulating material 270 extending from afirst main surface 110 to a second main surface 120 of the semiconductorchip 260. The semiconductor chip 260 further includes portions 810 of aninsulating material, protruding from the second main surface 120, theprotruding portions 810 forming a closed loop along a sidewall of thesemiconductor chip. In more detail, the protruding portions are arrangedalong an entire circumferential edge of the semiconductor chip 260 so asto enclose a central portion of the second main surface 120 of thesemiconductor chip 260. Components of the semiconductor device 250 areformed in the first main surface 110. According to an embodiment, ametallization layer may be arranged over the second main surface. Theprotruding portions overlap with the metallization layer in a verticaldirection. In some embodiments, portions of the seed layer 410 orresidues of the seed layer 410 may be arranged between the insulatingmaterial 270 and the protruding portions 810. According to furtherembodiments, the insulating material 270 may directly contact theprotruding portions 810.

FIG. 14 illustrates a method according to embodiments. As is shown, amethod of manufacturing a semiconductor device includes forming (S100) aplurality of separation trenches in a first main surface of asemiconductor substrate, a bottom side of the separation trenches beingdisposed in the semiconductor substrate. The method further includesfilling (S110) a sacrificial material in the separation trenches andremoving (S120) substrate material from a second main surface of thesemiconductor wafer to uncover a bottom side of the separation trenchesand the sacrificial material. The method then includes formingprotruding portions (S210) of an insulating material over the secondmain surface, the protruding portions being arranged at positions of theseparation trenches and on the sacrificial material and forming ametallization layer (S220) over the second main surface. The methodfurther includes mounting (S130) the semiconductor substrate 100 to aseparating carrier so that a second main surface of the semiconductorsubstrate is disposed on the side of the separating carrier and,thereafter, isolating or separating (S140) the semiconductor substrateinto a plurality of semiconductor chips. The protruding portions may beformed before forming the metallization layer, or the protrudingportions may be formed after forming and patterning the metallizationlayer.

FIG. 15 illustrates a flow diagram 900 of a method for manufacturing asemiconductor device. In box 901, at least one trench is formed in anon-device region of a first surface of the semiconductor wafer. Thenon-device regions are arranged between component positions that includedevice regions and a first metallization structure. In box 902, a firstpolymer layer is applied to the first surface of the semiconductor wafersuch that the trenches and edge regions of the component positions arecovered with the first polymer layer and such that at least a portion ofthe first metallization structure is uncovered by the first polymerlayer. In box 903, portions of second surface of the semiconductorwafer, which opposes first surface, are removed and portions of thefirst polymer layer in the non-device regions are revealed. Inparticular, the portion of the semiconductor wafer forming the base ofthe trench is removed so that portions of the first polymer layerarranged in the trenches are revealed to form a channel including thefirst polymer layer that extends from the first surface to the workedsecond surface and throughout the thickness of the wafer. In box 904,the first polymer layer arranged in the non-device regions is at leastpartially removed to form a plurality of separate semiconductor dies.The first polymer layer may be removed by cutting or sawing, forexample.

In some embodiments, the polymer layer may be replaced by a sacrificiallayer or an insulating layer.

Typically, the component positions are arranged in the semiconductorwafer in rows and columns. The non-device regions are arranged betweenand delineate neighbouring component positions such that the non-deviceregions when viewed form above form a pattern of orthogonally arrangedstripes. The non-device regions may also be referred to as saw streetsor kerfs. The first polymer layer arranged in the non-device regionsalso has the form of orthogonally arranged stripes.

The semiconductor wafer may also be referred to as a semiconductorsubstrate and may include a single crystal wafer, for example <100> Si.However, the semiconductor wafer may also include multiple layerstructure including non-semiconductor materials such as a semiconductoron insulator structure.

The first polymer layer is inserted into the trenches and also onto theedge regions of the component positions and, in some embodiments, ontoedge regions of the first metallization structure. However, at least aportion of the first metallization structure, such as a contact pad,remains uncovered by the first polymer layer. The first polymer layerhas a patterned or structured form and is discontinuous. The portion ofthe first metallization structure which is uncovered by the firstpolymer layer may form the base of a square or rectangular recessincluding side walls formed by strips of the first polymer layerdefining a continuous boundary around the uncovered area of the firstmetallization structure. The first metallization structure may notextend into the non-device region. In some embodiments, edge regions ofthe component positions may be free from the first metallizationstructure.

The first metallization structure may include multiple conductive andinsulative layers with conductive vias extending through insulationlayers arranged between the conductive layers to electrically couple theconductive layers. The outermost conductive layer may provide one ormore contact pads. For example, for a transistor device, the outermostconductive layer of the first metallization structure may include acurrent electrode contact pad, for example a source contact pad, and acontrol electrode contact pad, for example a gate conduct pad in eachcomponent position. The first metallization structure may also be calleda metallization layer or simply metallization.

The relative height between the first polymer layer and the firstmetallization layer may vary. In some embodiments, the first polymerlayer has a greater height that the first metallization layer so thatthe first metallization layer or each pad may form the base of a recessthat is surrounded and bounded on all lateral sides by portions of thefirst polymer layer. In some embodiments, the first polymer layer isarranged on edge regions of the first metallization layer in the deviceregions so that a central portion of the first metallization layer isuncovered by the first polymer layer and forms the base of a recesshaving side walls formed by portions of the first metallization layerarranged in the edge regions of the first metallization layer.

In some embodiments, the first polymer layer and the first metallizationlayer have substantially the same height and are substantially coplanar.In these embodiments, the first polymer layer may contact only the sidefaces of the first metallization layer so that the entire lateral extentof the first metallization layer is exposed from the first metallizationlayer.

The method may be described as a so-called “dicing before grinding”method. The trenches have a depth such that the base of the trench isformed by the portion of the semiconductor wafer. The trenches formed inthe non-device regions of the first surface of the semiconductor waferpartially separate the component positions from the wafer. The depth ofthe trench from the first surface may be substantially the same as or,in some embodiments, greater than the desired final thickness of thesemiconductor device which is to be formed from the component positions.Consequently, when the material is removed from the second surface ofthe semiconductor wafer and the thickness of the semiconductor wafer isreduced to the desired final thickness of the semiconductor devices, thepolymer material arranged in the trenches is exposed in the workedsecond surface. The semiconductor material of the component positions isseparated from the remainder of the semiconductor material of the waferand is mechanically bound by the first polymer layer to form an article.Each of the separated regions of semiconductor material or componentpositions may provide a semiconductor die which may include one or moresemiconductor devices, for example a transistor device, such as aMOSFET.

The resulting article or structure may be descried as a composite waferin which component positions including semiconductor material areembedded in a matrix of the first polymer layer. The semiconductor diesand the first polymer layer and extend throughout the thickness of thecomposite wafer. The first polymer layer extends between the side facesof neighbouring semiconductor dies and over edge regions of thesemiconductor dies of the component positions on the first surface. Theworked second surface of the composite layer includes regions ofsemiconductor material laterally surrounded by polymer material. Thecomposite wafer may then be worked to separate or singulate individualsemiconductor dies from the composite wafer.

The individual semiconductor dies may be separated from the compositewafer by inserting a separation line into the first surface, inparticular, into the non-device areas of the first surface. Theseparation line may have a width that is less than the width of thetrench such that at least portions of side faces of the plurality ofseparate semiconductor dies include a portion of the first polymerlayer. The separation line may be inserted by cutting, for example bymechanical cutting using a saw, or by laser cutting, for example.

The first polymer layer may include a polymer that may be cured withlittle or no shrink and, therefore, reduction in volume. The firstpolymer layer may be cured or cross-linked by application of heat and/orlight, for example UV light. In some embodiments, the first polymerlayer is a thermosetting polymer.

The first polymer layer may include a cross-linked polymer which cureswithout a polycondensation reaction and may be solvent-free. Suchmaterials may be cured with little or no shrink or reduction in volumeand without the formation of gases. Therefore, void formation,particularly in the portion of the material arranged in the trenches canbe avoided. In some embodiments, the first polymer layer may be an epoxylayer.

The first polymer layer may include a solvent-free multi-componentthermosetting epoxy in an uncured or partially cured state. The firstpolymer layer may include a filler or may filler-free. The first polymerlayer may be electrically insulative.

The first polymer layer may be applied to the first surface of thesemiconductor wafer by printing and may be applied as a patterned orstructured layer. After application, the first polymer layer may be atleast partially cured, for example by applying heat and/or UV light.

The first metallization structure may include a redistribution structureincludes two or more metal layers separated from one another byinsulating material or inter layer dielectric material which areelectrically coupled together by conductive vias. The outermost metalliclayer may provide contact pads. In the case of a transistor, theoutermost metallic layer may provide a large current electrode contactpad, which may be coupled to source, and a smaller control electrodecontact pad, which may be coupled to gate, for example.

A carrier may be attached to the first surface of the semiconductorwafer to provide support whilst portions of the second surface of thesemiconductor wafer are removed. The carrier may be a glass carrier, forexample. The carrier may be attached by an adhesive layer.

The adhesive layer may compensate for any topology of the first surface.For example in embodiments in which the first polymer layer covers edgeregions of the first metallization structure and is therefore positionedin a plane above that of the outermost surface of the firstmetallization layer so that the first metallization layer forms the baseof a recess in the first polymer layer, the adhesive may fill therecess.

The second surface of the semiconductor wafer may be removed by grindingand/or chemical mechanical polishing, for example. In some embodiments,a combination of grinding and/or chemical mechanical polishing followedby etching may be used. A wet chemical etching or plasma etching processmay be used. Etching may be used to remove material which exhibitsdamage caused by the mechanical or chemical mechanical grindingprocesses.

In some embodiments, the worked second surface of the semiconductorwafer may be further processed before the semiconductor devices areseparated from the composite semiconductor wafer.

In some embodiments, one or more conductive layers are applied to theworked second surface to form a second metallization structure. Thesecond metallization structure may extend continuously over the workedsecond surface and extend over the semiconductor material and over thefirst polymer layer.

Portions of the second metallization layer may be removed from the firstpolymer layer arranged in the non-device regions to produce discreteconductive portions in the device regions on the worked second surface.

For example, a second metallization structure may be applied to at leastthe device regions of the semiconductor dies in the component positionsof the second surface of the semiconductor wafer. The secondmetallization structure may provide a ground plane or an electrode inthe case of a vertical device such as a vertical transistor or avertical diode.

For a vertical device, the second metallization structure may be coupledto the second current electrode, for example drain in the case of aMOSFET transistor, and provide a second current electrode contact pad.

In some embodiments, after removal of the second metallization structurefrom the first polymer layer in the non-device regions, a portion of thefirst polymer layer arranged in the non-device regions is also removedto produce a recess surrounding the semiconductor dies at the workedsecond surface.

In some embodiments, a second polymer layer is applied to the workedsecond surface to cover at least the first polymer layer arranged in thenon-device regions.

The composition of the second polymer layer may be the same as thecomposition of the first polymer layer or may be different. In someembodiments, both the first polymer layer and the second polymer layerinclude epoxy.

Portions of the second metallization structure may remain uncovered bythe second polymer layer. In some embodiments, edge regions of thesemiconductor dies in the component positions are uncovered by thesecond metallization structure and covered by the second polymer layer.

In embodiments included first and second polymer layers arranged onopposing sides of the semiconductor dies, a composite wafer is formed inwhich at least edge regions of the two opposing sides of thesemiconductor dies are covered with an polymer material which alsoextends onto the side faces of the semiconductor dies. The first polymerlayer and the second polymer layer provide a matrix in which thesemiconductor dies are embedded and in which at least portions of themetallization structure on two opposing surfaces of the semiconductordies remain uncovered and exposed. The second polymer layer may be incontact with the portions of the first polymer layer arranged andextending between side faces of neighbouring semiconductor dies. Thefirst polymer layer and the second polymer layer may together fill theregions between side faces of the individual semiconductor dies in thecomponent positions.

In some embodiments, a second polymer layer is applied to the workedsecond surface before a second metallization structure is applied suchthat the first polymer layer arranged in the non-device regions iscovered by the second polymer layer and such that regions of the workedsecond surface comprising semiconductor material are uncovered by thesecond polymer layer.

In some embodiments, the second polymer layer may be applied to theworked second surface after the second metallization structure such thatthe first polymer layer and edge regions of the discrete conductiveportions of the second metallization structure are covered with thesecond polymer layer and such that regions of the discrete conductiveportions of the second metallization structure are exposed from thesecond polymer layer.

After application, the second polymer layer may be partially or fullycured, for example by the application of heat and/or UV light. Thesecond polymer layer may be applied using a printing technique, forexample. The second polymer layer may be selectively applied to producethe desired pattern directly or may be applied as a continuous layer andportions removed to produce the desired pattern.

In some embodiments, a conductive sublayer, for example a seed layer, isapplied to the worked second surface and the second polymer layer isapplied to the seed layer such that the first polymer layer arranged inthe non-device regions is covered by the seed layer and the secondpolymer layer and such that regions of the seed layer in the deviceregions are uncovered by the second polymer layer.

The second metallization structure may be built up by applying one ormore conductive layers to the seed layer in the regions of the workedsecond surface that are uncovered by the second polymer layer to formdiscrete conductive portions bounded by the second polymer layer to forma second metallization on the semiconductor dies.

In embodiments, in which a conductive sublayer is applied to the workedsecond surface and the second polymer layer is applied to the conductivesublayer, the conductive sublayer is positioned underneath the secondpolymer layer and between the first and second polymer layers in thenon-device regions. The conductive sublayer may serve as an electrodefor the selective deposition of the conductive layer may be applied tothe regions of the worked second surface that are uncovered by thesecond polymer layer in order to form discrete conductive portionsbounded by the second polymer layer and a second metallization on thesemiconductor dies. The patterned second polymer layer provides a maskfor determining the position of the discrete conductive portions and thesecond metallization structure on the semiconductor dies.

The second metallization structure may be built up to a thickness thatis the same as or less than the thickness of the second polymer layer.In some embodiments, the conductive layer may be built up to a thicknessthat is greater than than the thickness of the second polymer layer.

The semiconductor dies may be separated from the composite wafer bycutting along the non-device regions and therefore by cutting throughthe first polymer layer and the second polymer layer if present arrangedbetween the side faces of adjacent semiconductor dies. At least portionsof the first polymer layer and second polymer layer may be remain on theside faces of the semiconductor dies after separation or singulation andmay provide electrical insulation.

Various embodiments of methods for manufacturing a composite wafer arenow described with reference to FIGS. 16A to 16E.

FIG. 16A illustrates a semiconductor wafer 1000 having a first surface1001 and a second surface 1002 which opposes the first surface 1001. Thefirst surface 1001 includes a plurality of component positions 1003including device regions 1004 and a first metallization structure 1005arranged on the first surface 1001 in the device regions. Thesemiconductor wafer 1000 may be a silicon single crystal wafer. Thedevice regions 1004 may include structures suitable for producing atransistor device, such as a vertical MOSFET or a superjunction MOSFET.

Neighbouring component positions 1003 are separated and spaced apart bynon-device regions 1006. The interface between neighbouring componentpositions 1003 and the non-device regions 1006 is indicated by dashedlines and illustrates that the non-device regions 1006 have a width. Thecomponent positions 1003 are typically arranged in rows and columns sothat the non-device regions 1006 have the form of an orthogonal grid inplan view. The non-device regions 1006 may also be referred to as sawstreets or kerfs. The semiconductor wafer 1000 may include hundreds orthousands of component positions 1003. In some embodiments, eachcomponent position 1003 will provide a single semiconductor die whichmay include one or more semiconductor devices such as a transistordevice, for example, a vertical transistor. The first metallizationstructure 1005 may include a multi-layer structure including one or moreconductive layers with intervening insulation and/or passivation layers,whereby the conductive layers may be electrically coupled by one or moreconductive vias. The metallization structure 1005 may not extend to theboundary of the component positions 1003.

Some semiconductor devices such as vertical transistors may desirablyhave a thickness of less than 100 μm and may have a thickness of around20 μm, for example. In order to facilitate the production of the deviceregions 1004 and first metallization structure 1005, the semiconductorwafer 1000 may have an initial thickness t₁ which is substantiallygreater than the final desired thickness of the semiconductor devices.For example, the semiconductor wafer 1000 may have thickness of around700 μm. After processing to form the device regions 1004 and the firstmetallization structure 1005 on the first surface 1001, the thickness ofthe semiconductor wafer 1000 may be reduced by removing portions of thesecond surface 1002. The thickness of the semiconductor wafer 1008 maybe reduced by mechanical grinding and/or chemical mechanical polishingthe second surface 1002, for example, to produce a worked secondsurface.

FIG. 16B illustrates the semiconductor wafer 1000 after the introductionof trenches 1007 into the non-device regions 1006 in the first surface1001. The trenches 1007 are inserted to a depth d which is less than theinitial thickness t_(i) of the semiconductor wafer 1000 and thereforehave side faces and a base formed by the material of the semiconductorwafer 1000. The depth d of the trenches 1007 may be selected to beroughly the same as or greater than the desired final thickness t_(f) ofthe semiconductor devices. The trenches 1007 may have a width w_(t) thatthis less than the width w_(s) of the non-device regions 1006. Thedevice regions 1004 and the component positions 1003 are held togetherwithin the semiconductor wafer 1000 by the remaining portions ofsemiconductor wafer 1000.

The initial thickness t_(i) of the semiconductor wafer 1000 may bearound 700 μm and the depth d of the trenches 1007 may be around 30 μmto 35 μm for semiconductor devices having a final thickness t_(f) ofaround 20 μm. The first metallization structure may have a totalthickness t_(m) of around 10 μm.

FIG. 16C illustrates the semiconductor wafer 1000 after the applicationof a first polymer layer which may be an epoxy layer 1008, for example,to the first surface 1001 and, in particular, into the trenches 1007.The first epoxy layer 1008 has a lateral extent on the first surface1001 such that it is positioned on edge regions 1009 of the componentpositions 1003 and edge regions 1010 of first metallization structure1005. Portions 1011 of the first metallization structure 1005 remainuncovered by the first epoxy layer 1008. The first epoxy layer 1008 maybe applied in a pattern to the first surface 1001 using techniques suchas printing, for example, and cured by applied heat and/or light. Insome embodiments, the first epoxy layer 1008 may be applied as acontinuous closed layer and then structured to remove portions andexpose portions 1011 of the first metallization structure 1005 in thedevice regions 1003. In plan view, or when viewed from the top, thefirst epoxy layer 1008 may have the form of orthogonal stripessurrounding square or rectangular regions of first metallizationstructure 1005 such that the first metallization structure 1005 in thecomponent positions 1003 is covered in the edge regions 1009 by portionsof the first epoxy layer 1008. The first epoxy layer 1008 protrudesabove the exposed portions 1011 of the first metallization structure1005. The exposed portions 1011 of the first metallization structure1005 form the base of recesses formed above the device regions 1004 inthe first epoxy layer 1004.

FIG. 16D illustrates the semiconductor wafer 1000 after a carrier 1012has been attached to the first surface 1001 and, in particular, to theoutermost surface 1013 of the first epoxy layer 1008.

The carrier 1012 may be a glass carrier and may be attached to theoutermost surface 1013 of the first epoxy layer 1008 by a furtheradhesive layer not illustrated in the drawings.

In some embodiments, such as that illustrated in FIG. 16D, the firstepoxy layer 1008 has a structured form and protrudes above the firstmetallization structure 1005, regions 1014, which are formed between theexposed regions 1011 of the first metallization structure 1005 and thecarrier 1012 and bounded on the sides by the first epoxy layer 1008, maybe filled by the further adhesive layer.

FIG. 16E illustrates the removal of portions of the second surface 1002of the semiconductor wafer 1000 as indicated schematically by the arrows1014 to produce a worked second surface 1015 including semiconductormaterial portions 1016 surrounded on all sides by portions 1017 of theepoxy layer 1008 that were arranged in the trenches 1007. The workedsecond surface 1015 may include isolated portions of semiconductormaterial 1016 mechanically held together and spaced apart by regions ofthe first epoxy layer 1008. This structure may be called a compositewafer 1018. At this stage, the component positions 1003 have beenseparated from the wafer and form semiconductor dies as they are nolonger mechanically connected to one another by regions of asemiconductor material. The thickness of the semiconductor wafer 1000may reduced to t_(f) which may be around 20 μm.

In some embodiments, the carrier 1012 may be removed, and thesemiconductor devices separated or singulated from the composite wafer1018 by removing the first epoxy layer 1008 or by cutting through theepoxy layer 1008.

FIG. 16F illustrates a semiconductor wafer 1000′ that includes aplurality of component positioned 1003 spaced from their immediateneighbours by a non-device region 1006 or kerf. Trenches 1007 arearranged in the non-device regions 1006. The arrangement of the firstepoxy layer 1008 with respect to the first metallization structure 1005differs from that of the embodiment illustrated in FIG. 16C. The firstepoxy layer 1008 is inserted into the trenches 1007 and may fill thetrenches 1007 and the space between the discrete portions of the firstmetallization structure 1005 arranged in the device regions of thecomponent positions 1003. The edge regions 1009 of the componentpositions are covered by the first epoxy layer 1008. The entire lateralextent of the first metallization structure 1005 is exposed from thefirst epoxy layer 1008. The outermost surface 1013 of the first epoxylayer 1008 is substantially coplanar with the outermost surface of thefirst metallization structure 1005 so that sides faces of the firstmetallization structure 1005 are bordered by the first epoxy layer. Thefirst epoxy layer 1008 may be considered to act as a planarizationlayer.

In some embodiments, further processing of the rear surface 1016 of thecomponent positions is not required so that the composite wafer 1018having the structure illustrated in FIGS. 16E and 16F may be singulated.

In some embodiments, a second metallization structure may be applied tothe worked second surface 1015. FIGS. 17A to 17E illustrate methods forfabricating a semiconductor device, in particular a semiconductor deviceincluding a metallization structure on two opposing surfaces. Thesemiconductor device may be a vertical device, i.e. a device having adrift path between two opposing major surfaces. Examples of a verticaldevice include a vertical diode and a vertical transistor.

FIG. 17A illustrates the semiconductor wafer after the application of acontinuous and closed second metallization structure 1020 to the workedsecond surface 1015. The second metallization structure 1020 may includea seed layer 1021 which is applied to the second surface 1015 by vacuumdeposition techniques, such as physical vapour deposition, for examplesputtering, or chemical vapour deposition. The second metallizationstructure 1020 may include one or more further layers 1022 which aredeposited on the seed layer 1021 using the same or different techniques.For example, the one or more further metallic layers 1022 may bedeposited onto the seed layer 1021 by electroplating. The totalthickness of the second metallization structure 1020 may be around thesame total thickness as the first metallization structure 1008 on theopposing side of the component positions. In some embodiments, thesemiconductor material may have a thickness around 20 μm, the firstmetallization structure 1005 may have a thickness of around 10 μm andthe second metallization structure 1020 may have thickness of around 10μm.

FIG. 17B illustrates a view of the semiconductor wafer 1000 afterfurther processing of the second metallization structure 1020 to removeportions of the thicker metallization layer 1022 in the non-deviceregions 1006 and in regions above the first epoxy layer 1008. The secondmetallization structure 1020 may be structured using a mask and etchingaway portions of the second metallization structure exposed from themask. Discrete portions 1023 of the second metallization structure 1020are formed on the device regions 1003. In some embodiments, theunderlying regions of the first epoxy layer 1008 are exposed. In someembodiments, the seed layer 1021 remains as a continuous layer on theworked second surface 1015. The seed layer 1021 may include a metalwhich is capable of acting as an etch stop. For example, the seed layer1021 may include titanium and the metallization layer 1022 may includecopper. The lateral extent of the remaining portions 1023 of themetallization layer 1022 may be slightly less than the lateral extent ofthe semiconductor material of the component positions 1003.

In some embodiments, the seed layer 1021 is also removed from thesurface 1017 formed by the first epoxy layer 1008 arranged in thetrenches. Edge regions and side faces of the semiconductor material atthe second surface 1015 may be exposed from the first epoxy layer 1008as well as from the second metallization structure 1020 including theseed layer 1021.

FIG. 17C illustrates an embodiment in which the seed layer 1021 andfurther layer(s) 1022 of the second metallization structure 1020 areremoved from the non-device regions 1006 of the worked second surface1015 such that portions of the first epoxy layer 1008 arranged in thetrenches 1007 and edge regions 1024 of the second surfaces 1016including semiconductor material are exposed from the seed layer 1021and the second metallization layer 1022. Outermost portions of the firstepoxy layer 1008 are also removed so that a portion of the side faces ofthe semiconductor material of the component positions 1003 adjacent theworked surface 1015 are exposed. The metallization structure 1020includes a plurality of separate discrete regions 1023 each includingthe seed layer 1021 and a metallization layer 1022 arranged on thesecond surfaces 1016 of the component positions 1003 in the deviceregions 1004.

In order to separate or singulate the semiconductor devices from thecomposite wafer, the carrier 1012 may be removed from the first surface1001 and from the first epoxy layer 1008, a further carrier 1030, suchas a tape or foil may be attached to the second metallization structure1020, the composite wafer inverted, as illustrated in FIG. 17D. Thesemiconductor devices may be separated from the composite wafer byinserting a separation line 1031 or removing material along theseparation line 1031 in the non-device regions 1006 through the firstepoxy layer 1008 from the first surface 1002 to the second surface 1015.The separating line may be inserted by cutting, for example sawing usinga diamond saw, or laser sawing, as indicated schematically in FIG. 17Dby arrow 1032.

In some embodiments, such as that illustrated in FIG. 17E, a secondpolymer layer 1025 is applied to the worked second surface 1015 of thecomposite wafer. The second polymer layer 1025 may include epoxy, forexample. The second epoxy layer 1025 may be selectively applied to thenon-device regions 1006 such that the second epoxy layer 1025 isarranged between neighbouring component positions 1003 and is in contactwith the first epoxy layer 1008 arranged between the semiconductordevice positions 1003. The second epoxy layer 1025 may have the form ofan orthogonal grid of striped portions. The striped portion may have awidth w that is greater than the width w_(f) of the underlying portionof the first epoxy layer 1008 so that the second epoxy layer 1025overlaps edge regions 1026 of the outer surface 1027 of the secondmetallization structure 1020. The second epoxy layer 1025 may also bearranged on edge regions 1024 of the semiconductor material and on edgeregions 1026 of the portions 1023 of the second metallization structure.Portions 1028 of the second metallization structure 1020, for examplecentral regions of the portions 2013, remain uncovered by the secondepoxy layer 1025 and form a base of a recess bounded by walls providedby the second epoxy layer 1025. The arrangements of the first epoxylayer 1008 and the second epoxy layer with respect to the non-deviceregions 1006 may be substantially vertically aligned with one another.

This structure may be considered to be a composite wafer which includessemiconductor dies of the component positions 1003 embedded in a matrixincluding the first epoxy layer 1008 and the second epoxy layer 1025.Edge regions 1010 of the first metallization structure 1005 and edgeregions 1009 of the first surface of the semiconductor material arecovered by the first epoxy layer 1008. Edge regions 1026 of the secondmetallization structure 1023 and edge regions 1024 of the second surface1016 of the semiconductor material are covered by the second epoxy layer1025. The semiconductor material of a component position 1003 extendsthrough the thickness of the composite wafer and is spaced apart fromsemiconductor material of immediate neighbouring ones of the componentportions 1003 by the first and second epoxy layers 1008, 1025. In thisembodiment, the non-device regions 1006 include only epoxy material and,in particular, first epoxy layer 1008 and the second epoxy layer 1025.

In order to produce separate devices from the composite wafer, theoutermost surface 1028 of the second epoxy layer 1025 may be attached toa carrier foil or tape, the carrier 1012 removed, the composite waferinverted and individual devices separated from the composite wafer bycutting or sawing in the non-device regions 1006 by inserting thecutting line into the first surface 1002. The non-device regions 1006include only epoxy material which may assist in achieving a well-definedand accurately positioned cut.

In some embodiments, the second epoxy layer 1025 protrudes above theoutermost surface 1027 of the second metallization structure 1020 andmay be used as a solder resist layer.

FIG. 18 illustrates an example of a semiconductor device 1100 which maybe singulated from the composite wafer having the structure illustratedin FIG. 17D. The semiconductor device 1100 may be singulated from thecomposite wafer by inserting a separation line, for example using a saw,into the non-device positions 1006 through the entire thickness of thefirst epoxy layer 1008 and second epoxy layer 1025.

The semiconductor device 1100 includes a semiconductor die 1101 having afirst surface 1102 on which a first metallization structure 1117 isarranged. The semiconductor die 1101 has a second surface 1103 opposingthe first surface 1102 including a second metallization structure 1104which may include a seed layer 1105 arranged on the semiconductormaterial of the second surface 1103 and one or more further metallicsublayers 1106 arranged on the seed layer 1105. The semiconductor device1100 includes a first epoxy layer 1107 which is arranged on edge regions1108 of the first surface 1102 and side faces 1109 of the semiconductordie 1101 and may also extends onto edge regions 1110 of the firstmetallization structure 1117.

The first epoxy layer 1107 may cover the entire side face 1109 of thesemiconductor die 1101 but may have varying thickness. In particular,the thickness may be greater adjacent the first surface 1102 thanadjacent second surface 1103. The semiconductor component 1100 may alsoinclude a second epoxy layer 1112 which is arranged on edge regions 1113of the second surface 1103 and on side faces 1114 of the secondmetallization structure 1104 and which is positioned on the outermostsurface 1115 of the first epoxy layer 1107 in regions adjacent side face1109 of the semiconductor die 1101. The interface 1116 between the firstepoxy layer 1107 and the second epoxy layer 1112 may be inclined and maybe inclined outwardly in a direction from the second surface 1130 to thesecond surface 1102. The first epoxy layer 1107 and the second epoxylayer 1112 may provide an encapsulant for protecting the side faces andedge regions of the semiconductor die 1101.

The outermost upper 1118 plane of the electronic component 1100 may beprovided by portions of the first epoxy layer 1107. The outermost lowerplane 1119 of the semiconductor component 1100 may have different forms.In some embodiments, the outermost lower plane 1119 may include regionsof the second metallization structure 1104 and regions of the secondepoxy layer 1112 which are substantially coplanar.

The planar surface regions 1120 of the first epoxy layer 1107 and planarsurface regions 1121 of the second epoxy layer 1112 may have a surfaceroughness which is less than the surface roughness of the side faces1122. The side faces 1122 may have a surface structure characteristic ofworking and in particular characteristic of the separation method usedto separate the semiconductor devices 1100 from the composite wafer. Forexample, in embodiments in which the composite wafer is singulated usinga mechanical saw, the side faces 1122 may include cutting marks. Inembodiments in which laser ablation is used to separate the compositewafer into separate devices, the side faces 1122 may include burn marks.

In some embodiments, the second surface 1015 of composite wafer issubjected to processing such that a conductive seed layer 1021 isapplied to the worked second surface 1015 and the second epoxy layer1025 is applied onto the seed layer 1021.

FIG. 19 illustrates a cross-sectional view of a composite waferaccording to an embodiment in which the worked second surface 1015 ofthe composite wafer is processed such that a conductive seed layer 1021is applied to the worked second surface 1015 including the regions ofsemiconductor material and the first epoxy layer 1008. Afterwards, thesecond epoxy layer 1025 is applied onto the seed layer 1021. The secondepoxy layer 1025 may be selectively applied, for example by printing, tothe non-device regions 1006. The second epoxy layer 1025 may have toform of a grid of orthogonal elongate stripes in plan view. The lateralextent of each of the stripes w may be slightly larger or wider than thewidth w_(f) of the first epoxy layer 1008 arranged between the componentpositions. The thickness of the second metallization structure 1020 maythen be increased by applying the second metallization layer 1022 ontothe regions 1040 of the second surface 1015 which remain uncovered bythe second epoxy layer 1025, in particular onto the regions 1040 of theseed layer 1021 which remain uncovered by the second epoxy layer 1025.

Since the seed layer 1021 is continuous on the second surface 1017, theseed layer 1021 may act as an electrode in an electroplating method withwhich the second metallization layer 1022 is deposited. The thickness ofthe layer 1022 and of the second metallization structure 1020 may beincreased to the desired thickness and in some embodiments increasedsuch that the outermost surface is substantially coplanar with theoutermost surface of the second epoxy layer 1025. In some embodiments,the thickness may be increased sufficiently such that the thickness ofthe second metallization structure 1020 is greater than the thickness ofthe second epoxy layer 1025. In some embodiments, edge regions of thesecond epoxy layer 1025 may be covered by the second metallizationstructure 1020.

In embodiments in which the metallization layer 1022 is deposited afterapplication of the patterned second epoxy layer 1025, side faces of theseparate areas 1023 of the second metallization structure 1020 arebordered by the second epoxy layer 1025. The second epoxy layer 1025 maybe used as a mask to define the lateral extent of the secondmetallization structure 1020.

FIG. 20 illustrates a cross-sectional view of an electronic component1130 including a semiconductor device 1131. However, the electroniccomponent 1130 may include a semiconductor device according to any oneof the embodiments described herein or fabricated using any one of themethods described herein.

The semiconductor device 1131 may include a semiconductor die 1132including a first surface 1133 with a first metallization structure 1134and edge regions 1135 that surround the first metallization structure1134, a second surface 1136 opposing the first surface 1133 and with asecond metallization structure 1137, and side faces 1138. The edgeregions 1135 of the first surface 1133, edge regions 1139 of the firstmetallization structure 1134 and portions of the side faces 1138 arecovered by a first epoxy layer 1140. Edge regions 1141 of the secondsurface 1136 and portions of the side faces 1138 adjacent the secondsurface 1136 are covered by a second epoxy layer 1142. The second epoxylayer 1142 is in contact with the first epoxy layer 1140.

The electronic component 1130 also includes a plurality of leads. Thefirst metallization structure 1134 is coupled to a first lead 1143, forexample by a connector 1144 such as one or more bond wires or a contactclip, and the second metallization structure 1137 is coupled to a secondlead 1146 of the plurality of leads. The electronic component 1130 mayalso include a plastic housing composition 1147 that covers the firstepoxy layer 1140 and the second epoxy layer 1142 and portions of theplurality of leads.

The second lead 1146 may be a die pad so that the semiconductor device1131 is mounted on and the second metallization structure 1137 iscoupled to the die pad, for example by a layer of solder 1145. Inembodiments, in which the second epoxy layer 1142 protrudes below thelowermost plane of the second metallization structure 1137, the secondepoxy layer 1142 may act to control the lateral extent of the solderconnection by containing the solder 1145 within side faces bordering thesecond metallization structure 1137.

The first lead 1143 may be spaced apart from the second lead 1146. Insome embodiments two or more leads may be arranged adjacent, and spacedapart from, one or more side faces of a die pad. Each lead of theelectronic component 130, and a die pad if present, may include asurface that is exposed from the plastic housing composition 1147 andprovide an outer contact pad 1148 for the electronic component 1130.

The semiconductor device 1131 may be a vertical transistor, such as aMOSFET, for example a superjunction MOSFET. The first metallizationstructure 1134 may include a source pad 1149 and a gate pad, that cannotbe seen in the cross-sectional view of FIG. 20 , that are coupled to twodifferent leads. The second metallization structure 1145 may provide adrain pad 1150 which is mounted on the second lead 1146 This arrangementof the semiconductor device may be known as “drain down”.

The first and second epoxy layers 1140, 1142 may provide an innerencapsulant for at least the side faces 1138 of the semiconductor die1132 and be arranged within the plastic housing composition 1147providing the housing of the electronic component 1130. The electroniccomponent 1030 may have a package that conforms to a JEDEC standard, forexample a TO252 package.

In some embodiments, the semiconductor device 1131 may be a verticaltransistor and may be mounted in a so-called “source down” arrangement.

FIG. 21 illustrates a cross-sectional view of an electronic component1160 including the semiconductor device 1131 including a verticaltransistor having a “source down” arrangement. The source pad 1149 ispositioned and mounted on a first lead 1161 by a layer of solder 1162.The gate pad 1163 is arranged on the same surface 1133 of thesemiconductor die 1132 as the source pad 1149 and is positioned andmounted on a second lead 1164 by a layer of solder 1165. The second lead1164 is substantially coplanar with, and spaced part from, the firstlead 1161. The semiconductor device 1131 extends between the first lead1161 and the second lead 1164. The drain pad 1150 faces upwardly awayfrom the first lead 1161 and is coupled to a third lead, which cannot beseen in the cross-sectional view of FIG. 21 , by a connector 1166 suchas a bond wire or clip. The third lead is spaced apart from the die pad1161 and the second lead 1164.

The electronic component 1160 also includes a plastic housingcomposition 1167 providing the housing of the electronic component 1160.Portions of the leads 1161, 1164 and the die pad 1161 are exposed fromthe plastic housing composition 1167 to provide outer contacts 1168 forthe electronic component 1160.

The first and second epoxy layers 1140, 1142 may provide an innerencapsulant for at least the side faces 1138 of the semiconductor die1132 and be arranged within the plastic housing composition 1167. Thefirst epoxy layer 1141 may act to control the spread of the solder 1162,1165 from the source pad 1149 and gate pad 1163, respectively, forexample in embodiments in which the first epoxy layer 1041 borders theside faces of the source pad 1149 and gate pad 1163.

While embodiments of the invention have been described above, it isobvious that further embodiments may be implemented. For example,further embodiments may include any subcombination of features recitedin the claims or any subcombination of elements described in theexamples given above. Accordingly, this spirit and scope of the appendedclaims should not be limited to the description of the embodimentscontained herein.

What is claimed is:
 1. An electronic component, comprising: asemiconductor device including a semiconductor die including a firstsurface, the first surface including a first metallization structure andedge regions surrounding the first metallization structure, a secondsurface opposing the first surface and including a second metallizationstructure, and side faces extending between the first surface and thesecond surface, wherein the edge regions of the first surface andportions of the side faces are covered by a first polymer layer, whereinthe electronic component further comprises a plurality of leads and aplastic housing composition, wherein the first metallization structureis coupled to a first lead and the second metallization structure iscoupled to a second lead of the plurality of leads, wherein the plastichousing composition provides a housing of the electronic component, andwherein the first polymer layer is arranged within the plastic housingcomposition and provides an inner encapsulant for at least the sidefaces of the semiconductor die.
 2. The electronic component of claim 1,wherein the first polymer layer is arranged on edge regions of the firstmetallization structure or borders the first metallization structure. 3.The composite semiconductor substrate of claim 1, wherein the firstpolymer layer includes a cross-linked polymer.
 4. The compositesemiconductor substrate of claim 1, wherein the first polymer layerincludes a multi-component thermosetting epoxy.
 5. The electroniccomponent of claim 1, wherein the second lead is a die pad, and whereinthe semiconductor device is mounted on the second lead such that thesecond metallization structure is coupled to the die pad by solder. 6.The electronic component of claim 1, wherein each lead of the electroniccomponent includes a surface that is exposed from the plastic housingcomposition and provides an outer contact pad for the electroniccomponent.
 7. The electronic component of claim 1, wherein edge regionsof the second surface and portions of the side faces are covered by asecond polymer layer, wherein the second polymer layer is in contactwith the first polymer layer, and wherein the plastic housingcomposition covers the first polymer layer and the second polymer layer.8. The electronic component of claim 7, wherein the second polymer layerprotrudes below a lowermost plane of the second metallization structure,and wherein the second polymer layer contains the solder within the sidefaces bordering the second metallization structure.
 9. The electroniccomponent of claim 1, wherein the first polymer layer partially coversthe first metallization structure with a central part of the firstmetallization structure being exposed from the first polymer layer. 10.An electronic component, comprising: a semiconductor device including asemiconductor die including a first surface, the first surface includinga first metallization structure and edge regions surrounding the firstmetallization structure, a second surface opposing the first surface andincluding a second metallization structure, and side faces extendingbetween the first surface and the second surface, wherein the edgeregions of the first surface and portions of the side faces are coveredby a first polymer layer, wherein the electronic component furthercomprises a plurality of leads and a plastic housing composition,wherein the first metallization structure is coupled to a first lead andthe second metallization structure is coupled to a second lead of theplurality of leads, wherein the first polymer layer has an outer surfacewith a higher surface roughness in regions arranged on the side facesthan in regions arranged on the first surface.